Lightspring

Raised $3.6M in a Seed round, announced 22 September 2026.

Round

Lightspring closed a €3.1 million seed round to industrialize optical packaging for photonic chips and was named an i-Lab laureate.

Amount
$3.6M
Stage
Seed
Announced
22 September 2026
Leads
Atlantic, OVNI Capital
Other investors
Concept Ventures, Ixcore, Plug and Play Ventures
Use of funds
This funding will turn a lab result into a qualified industrial building block.
Checked
Amount and date matched across 2 press sources

Company

Manufactures optical interfaces for photonic integrated circuits using 3D lithography

Based in
France
Sector
Other
Website
light-spring.com ↗

Founders

  • Grégoire Bonnatco-founder and CEOLinkedIn ↗
  • Daniel Brunnerco-founder

Sources and links

Sources
Lightspring raises €3.5M to tackle photonic chip manufacturing bottleneck tech.eu
Besançon-based Lightspring raises over €3.5 million to industrialise photonic chip packaging eu-startups.com
Website
light-spring.com ↗
LinkedIn
Grégoire Bonnat ↗
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