$2MPre-Seed, 13 May 2026
Pre-seed to build advanced chip packaging capability in Malaysia.
- Amount
- $2M
- Stage
- Pre-Seed
- Announced
- 13 May 2026
- Lead
- Vertex Ventures Southeast Asia & India
- Other investors
- Southern Capital Group
- Use of funds
- Pre-seed to build advanced chip packaging capability in Malaysia.
- Checked
- Announced by the company
- Sources
- Malaysian chip startup FusionAP raises $2M vertexventures.sg
Malaysian chip startup FusionAP raises $2M technode.global