$3.3MSeed, 26 January 2026
First funding round, to accelerate product, go-to-market and partner ecosystem after 10x revenue growth.
- Amount
- $3.3M
- Stage
- Seed
- Announced
- 26 January 2026
- Lead
- RTP Global
- Other investors
- SaaStr Fund, Mu Ventures
- Use of funds
- First funding round, to accelerate product, go-to-market and partner ecosystem after 10x revenue growth.
- Checked
- Announced by the company
- Sources
- Consio AI raises $3.3M to build the phone layer of e-commerce consio.ai
Consio AI raises $3.3M to build the phone layer of e-commerce techstartups.com